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Fix logic board issues on your latest inventory without guessing pad locations. This BGA reballing stencil includes clear CPU position guides for the A18 and A18 Pro processors. You earn consistent results on every unit, which saves costly chips and keeps repair cycles fast.
The template aligns directly with the contact points for the iPhone 16, iPhone 16 Pro, iPhone 16 Plus, and iPhone 16 Pro Max. You sit the stencil firmly on the motherboard, then push paste evenly through each window. You skip manual marking and move straight to heating.
- Precise Openings match factory pads so you place solder accurately every time.
- Clear Grid Lines show center points and row offsets without blocking your sightline.
- Series-Specific Shape locks onto logic boards flat down to prevent shifting during work.
Tackling high-volume service requests runs smoother when your guides snap into place quickly. You spend your minutes adjusting preheat temperatures rather than wrestling with loose alignment tape. Upgrade your rework toolkit and deliver reliable restores that customers trust.
