Payment & Security
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.
Lay solder paste evenly across tiny cpu pads without the usual cleanup.
The Relife RL-044 steel mesh stencil aligns directly with your bga components for reliable paste transfer.
- Integrated steel mesh screen spreads your chosen paste uniformly over dozens of contact points at once to prevent bridge faults on ip6-17 boards.
- Firm metal frame construction keeps the mesh completely flat under your squeegee pressure for consistent paste thickness.
- Layout matched to the ip6-17 chipset places holes exactly where your repair team needs them so you skip custom tracing.
Slide the template onto your workbench next to the microscope and hot air station.
Position it over the target zone, press the paste, peel back, and move straight to reflow.
Wipe the edges clean after each use and store it flat to preserve its registration.
Pull it out for tight layouts or cracked flex connectors.
A clean paste layer lets you focus on the heating stage instead of the masking tape.
